CLAP introduces Organic Thin Film Transistor (OTFT) application technology at CES 2023

Broad patent portfolio of high-performance organic materials
Providing eco-friendly solutions-Low carbon emission effect in the OTFT manufacturing process
OTFT application prototypes in fingerprint recognition sensor/transparent Micro LED/Smart Glass

 
CLAP (CEO Sungho Kim, www.clap.co.kr), a company specializing in materials and parts for organic semiconductors and displays, participates in CES 2023, the world's largest consumer electronics and information technology exhibition, held at the Las Vegas Convention Center in the United States from January 5th to 8th. and exhibits Organic Thin Film Transistor (OTFT) application prototype.
 

[Clap Booth in CES 2023]

After acquiring OTFT material source patents and technologies from Germany's BASF, CLAP has its own organic semiconductor research fab and is actively developing application products based on material synthesis, application product design, and process technology, and is actively establishing business cooperation partnerships with domestic and global companies.
 
OTFT has the advantage of manufacturing devices inexpensively with various coating processes (solution materials) without expensive deposition equipment, and it is possible to manufacture devices on plastic films such as PET, COP, and PEN in a low-temperature process (below 120℃). It is a next-generation TFT that can make products that are not bent or easily broken. As a driving substrate for Flexible Electronics that requires flexible functions, the possibility of using OTFT is very high. In addition to flexible characteristics, it is possible to provide various sensor solutions for IoT infrastructure and various form factors such as bendable, rollable, and wearable.
 
In particular, the OTFT manufacturing process is eco-friendly. In the process, if the organic semiconductor and insulator contain the photoreactive material (CLAP’s Crosslinker : XL-100), direct patterning of the TFT becomes possible. The process can be reduced to 1/3 of the existing method using photoresist and reactive ion etching (RIE), hence obtaining an eco-friendly effect such as low carbon emission. This is one of the differentiated solutions of CLAP OTFT.

 
At this CES 2023, CLAP prepared an exhibition booth in the IoT Infrastructure Sector (Korea Sensor Pavilion, Booth No. 10824) to showcase OLED Mobile large-screen fingerprint recognition sensor solutions based on Organic Semiconductor materials and Active Matrix driving prototypes for transparent Micro LED.
 

[Image Resource : Clap]

Sungho Kim, CEO of CLAP, said, "Based on our core competencies in organic semiconductor materials and parts, we are prioritizing commercialization of TFT drive substrates for large-screen fingerprint recognition sensors and transparent and flexible Micro LED Displays. It will further promote technology through participation in CES 2023 exhibition and expand cooperative partnerships with global companies. Ultimately, CLAP wants to continue as an eco-friendly company that uses less energy, less waste, and less harmful substances based on organic semiconductor materials, and wants to become the world's best company in Flexible Electronics applications.”
 
[Introduction to CLAP]
CLAP is a start-up established by key personnel with more than 30 years of experience in the organic semiconductor and display industries. It is a top-notch research and development (R&D) company in Korea that holds more than 700 patents in related fields. In Korea, CLAP was certified as a 'specialized company for materials parts equipment' and was selected for the 'Baby Unicorn 200 Fostering Project' in recognition of its organic semiconductor technology by Korean government, and also won Korean government Award 'Ministry of Trade, Industry and Energy Award' of the Information Display Grand Prize at K-Display 2022 for its OTFT-based fingerprint recognition solution technology. CLAP is preparing for future growth by building business cooperation partnerships with domestic and global companies.
  

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